The pick and place machine head is a key part of the Panasonic placement. After picking up components, it can automatically correct the position under the control of the correction system, and accurately place the components to the designated position.
In the structure of the pick and place, the frame is the foundation of the machine, and all the transmission, positioning, and transmission mechanisms are firmly fixed on it. At present, the mainframes of various forms can be divided into two types: integral casting type and steel plate welding type. However, since most types of placement machines and their various feeders are also placed on it, the frame should have sufficient machinery. Strength and rigidity.
The conveying mechanism refers to an ultra-thin belt conveying system installed on the track. The main function of the conveying mechanism is to send the PCB that needs to be placed to a predetermined position, and then the SMA is sent to the next process after the completion of the placement.
4, X, Y positioning system
X, Y positioning system is not only the key mechanism of the placement machine, but also the main index for evaluating the accuracy of the placement machine. It includes X, Y transmission structure and X, Y servo system.
5.Optical alignment system
Alignment of the pick and place machine means that the placement machine must ensure that the suction nozzle is in the center of the component when it sucks the component, so that the center of the component and the center line of the main axis of the placement head remain the same.
In the chip mounter, the feeder occupies a large number and position, and the role is to provide the chip components SMC / SMD to the placement head in accordance with a regular pattern and order for accurate and convenient picking.
A variety of sensors are installed in the SMT chip shooter, which can perform component electrical performance inspections. They are like the eyes of the placement machine and constantly monitor the normal operation of the machine. Commonly there are mainly pressure sensors, negative pressure sensors and position sensors. The more sensors are used, the higher the level of intelligence of the chip shooter.