1. The structure of the multi-function SMD placement machine mostly adopts the arch structure, which has the characteristics of high precision and good flexibility.
2. Most of the X and Y positioning systems are driven by full-closed-loop servo motors, and linear grating encoders are used for direct position feedback to avoid errors due to screw distortion. Some use dual motors and dual screw rods to drive on both sides of the platform on the y-axis, and use dual linear gratings for feedback, which can effectively reduce the waiting caused by the static placement of the head and reduce the asynchronous deformation of the beam Error. There are more advanced linear magnetic levitation motors. In addition to the technical characteristics of dual drives, they also have the characteristics of direct drive, less wear on the mechanical structure, fast feedback, quiet, easy maintenance and high precision.
3. The multi-kinetic energy pick and place machine mostly adopts a fixed circuit board, and uses the movement of the placement head to achieve X and y positioning, and will not cause large or heavier components to shift due to inertia due to the movement of the table.
4. Can accept all material packaging methods, such as tape, tube, box and tray. In addition, when there are more materials in the tray, a multi-layer special tray feeder can be installed.
5. In addition to traditional vacuum suction nozzles, special suction nozzles can be used for special-shaped components that are difficult to suck. In addition, pneumatic grippers can be used for components sucked by vacuum suction nozzles.
6. When the components are calibrated, a top-view camera is generally used, which has the functions of front light, side light, backlight and online light, which can identify various components. If the size of the component is too large and exceeds the FOV of the camera, the top-view camera can also perform comprehensive analysis and correction after taking multiple videos. The placement head of some multifunctional placement machines is also equipped with a placement head moving camera, which can identify various smaller components.
7. In some products, some perforated plug-in (Pin h Paste) components also need to be mounted at the same time as other SMD components and processed by reflow soldering. The insertion of such perforated plug-in components requires the machine to have high pressure placement Ability. The placement head of some multifunctional placement machines has high-pressure placement capabilities, and the placement pressure can be controlled by a program, up to 5kg.
8. Some multi-function SMT chip mounter can be equipped with a flux dipping assembly system (Flux Dipping Assembly), which can carry out component stack packaging (Package on Package) and flip chip (Flip Chip) placement.
9. Some multifunctional PCB chip shooter can also be equipped with a dispensing head for dispensing before placement, tin patching or under fill for some components.